型號 / 廠家，封裝，批號，備注，訂購

Package Dimension / Samsung Electronics,Datasheet,06/07+,28TSOP2-300 Package 訂購 PDF文檔

Package Information / Vishay,Datasheet,06/07+,28 LEAD LCC 訂購 PDF文檔

Package Thermal ization / PACKAGE THERMAL ACTERIZATION,Datasheet,06/07+,National Semiconduct 訂購 PDF文檔

Packages Notes Processing / ,,,原裝現(xiàn)貨 訂購 PDF文檔

Package Thermal Considerations / Texas Instruments,Datasheet,07+,Application Note 訂購 PDF文檔

Packages / CML Microcircuits,Datasheet,06/07+,A Complete presentat 訂購 PDF文檔

Packages and Packing / Advanced Micro Devices,Datasheet,06/07+,Trays Part 12 訂購 PDF文檔

Packaging Options for Secure Memory Products / Atmel,Datasheet,06/07+,Smart Card Modules a 訂購 PDF文檔

PACN10 / Electronic Devices Inc,Datasheet,06/07+,Center-Tapped Negati 訂購 PDF文檔

Packaging Diagrams / Microchip Technology,Datasheet,06/07+,Packaging - Outlines 訂購 PDF文檔